The aim of the ESSCIRC conference is to provide an annual European forum for the presentation and discussion of recent advances in solid-state circuits. ESSCIRC, and its sister conference ESSDERC, (which focuses on solid-state devices and technologies), share a single Steering Committee, and are held together to enable both communities to share advances in the technologies and design which enable increasing levels of sophistication and performance in integrated systems. The advances in silicon technology and the conflicting opportunities and constraints on designers demand closer than ever interaction between technologists, device experts, and circuit and system designers. While keeping separate Technical Programmes, ESSCIRC and ESSDERC will share Plenary Keynote Presentations and Joint Technical Sessions on topics chosen to bridge both communities. Attendees registered for either conference are encouraged to attend any of the scheduled parallel sessions of their choice. Submissions to ESSCIRC 2009 are solicited describing original contributions in the field of silicon design and implementation. The conference’s core themes are set out below. The programme committee also welcomes novel contributions from other related areas.
Analog Circuits
Amplification stages, power amplifiers for audio applications, continuous and discrete time filters, comparators, instrumentation and sensor interfaces, voltage references, LDOs, DC-DC converters, HV circuits.
Data Converters
Nyquist rate and oversampled A/D and D/A converters, sample-and-hold circuits, A/D and D/A converter calibration and error correction circuits.
RF Circuits and Devices
RF/IF/analog baseband circuits including LNAs, mixers, Pas, IF amplifiers, power detectors, modulators, demodulators, VCOs, PLLs, frequency synthesizers, frequency dividers, integrated passive components including microwave components over silicon substrates
Wireless and Wireline Communication Circuits
Receivers/transmitters/transceivers for wireless systems, base stations and handsets, advanced modulation systems, TV/radio/satellite receivers, UWB and data links, wireless sensor networks, RFIDs.
Sensors, Imagers, MEMS, Bioelectronic Integration
Sensor subsystems and interfaces, accelerometers, temperature sensing, imaging circuits, MEMs subsystems, RF MEMs, bioelectronic systems, implanted electronic ICs, telemetry.
Digital and Memory Circuits
Digital circuit techniques, I/O and interchip communication, reconfigurable digital circuits, clocking memories, microprocessors, DSPs, arithmetic building blocks.
High Speed Interfaces
Gigabit serial links,CDR, equalization, memory interfacing, bus interfacing, multirate link IC's, pre-emphasis de-emphasis circuitry , PCI-express 3, SATA etc.
ESSDERC/ESSCIRC JOINT SESSIONS
These sessions will focus on topics at the boundary between design and technology depending on the submitted abstracts. Contributions are solicited (but not limited) in the areas of circuit design and simulation techniques for process variability in nm-scale technologies as well as of microwave components over silicon substrates.
